Film defect inspection device
Inspection of 300mm wafers can be performed in less than one second for the entire field of view in a single shot.
【Device Overview】 It is capable of inspecting 300mm wafers in less than one second for the entire field of view in a single shot. Due to the short inspection time, it is also adopted in fully automated inspection lines. It starts with a small field optical system and can be applied to internal void inspections by using infrared as an optional light source. In recent years, wafers have been getting thinner, but this is a high-precision wafer crack inspection device that quickly inspects the entire field of view for issues such as the unevenness of BG processing, polishing marks, and chip cracks caused by stress. 【Device Features】 In addition to automatic inspection, a standalone type is also available, allowing for manual inspection. It can set any slice level, enabling inspections tailored to specific needs. Depending on the application, it also has a function for removing so-marks, automatically extracting defect components excluding polishing marks. 【Device Applications】 ● Patterned wafer crack inspection ● Bare wafer crack inspection ● Wafer edge damage inspection ● Evaluation of BG polishing marks ● Evaluation of slurry ● Residual stress in glass substrates ● Evaluation of stress relief ● Tension inspection of BG tape ● Inspection of distortion and scratches on compound wafers
- 企業：ブルーオーシャンテクノロジー
- 価格：Other
